CMP Mounting Tape for Semiconductor Polishing Pad Assembly

CMP Mounting Tape for Semiconductor Polishing Pad Assembly | Adhesive Film & Tape Manufacturer - Celadon Tech

Celadon Tech is a Taiwan-based manufacturer specializing in CMP Mounting Tape for Semiconductor Polishing Pad Assembly, adhesive films, industrial tapes, self-adhesive vinyl and protective films for high-consequence applications in automotive, electronics, marine and signage industries.

Backed by proprietary Thick Coating and Partial Control technologies, Celadon Tech develops custom OEM/ODM solutions that deliver controlled adhesive thickness, precise coating patterns and reliable performance where standard off-the-shelf materials fall short.

With a strong R&D culture, ISO-based quality systems and readiness for REACH/RoHS and other compliance requirements, Celadon Tech helps global OEMs, converters and distributors reduce failure risk, shorten qualification time and secure long-term, stable adhesive material supply.

Celadon Tech invites you to explore our high-quality Color Vinyl, Laminating Film, CAD/CAM Film, Color Changing Film, Glitter Paper, Metallic Paint Film, Adhesive Transfer Tape. Contact Us for more details!

CMP Mounting Tape for Semiconductor Polishing Pad Assembly

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Recommended Intro

Celadon CMP Mounting Tape is a high-performance double-sided adhesive tape specifically designed for semiconductor polishing pad assembly applications.

The product has been successfully used within Taiwan's semiconductor supply chain for more than 10 years, providing reliable bonding performance for CMP polishing pads under demanding production environments.

Featuring a thick acrylic adhesive construction, precision PET carrier film, and high shear resistance, the tape helps manufacturers improve pad installation quality, reduce bubble defects, and maintain stable polishing performance throughout the process lifecycle.

Common Challenges in CMP Pad Assembly

Bubble Formation During Pad Lamination

Air entrapment can lead to inconsistent polishing performance and reduced process stability.

Thick Adhesive Uniformity

Uneven adhesive coating may create bonding inconsistencies and increase installation time.

Wrinkle Formation During Converting

Improper tape structure can introduce internal stress and wrinkle defects during rewinding and storage.

Long-Term Shear Stability

CMP processes require stable bonding performance under continuous mechanical and thermal stress.

How Celadon Solves These Challenges

Thick Adhesive Coating Technology
Bubble Reduction Technology
Dual Release Liner Structure
High Shear Acrylic PSA

Semiconductor Case Study

CMP Mounting Tape Proven in Production for Over 10 Years

A leading semiconductor supply chain partner required a high-performance mounting tape solution capable of supporting stable polishing pad installation while minimizing bubble defects and converting issues.

Celadon developed a thick acrylic adhesive tape platform featuring precision coating technology, bubble reduction capability, and optimized winding structures.

The solution has been successfully used in semiconductor production environments for more than 10 years.

Future Platform Development

The coating and adhesive technology used in Celadon CMP Mounting Tape can also be adapted for semiconductor back grinding (BG) tape related applications, enabling customers to leverage a proven adhesive platform across multiple semiconductor processes.