CMP is a process used in semiconductor manufacturing to produce a flat, uniform surface on a wafer. The process involves the use of a rotating pad and a slurry, which is a mixture of chemicals and abrasive particles. The wafer is placed on the pad and then subjected to pressure and movement, which removes material and produces a smooth, uniform surface.

One of the main advantages of the CMP process is its ability to produce a highly uniform surface, which is essential for the functioning of many semiconductor devices. The process is also highly efficient, allowing for the production of large numbers of wafers in a short amount of time.

Wafer bonding is an essential step in the CMP process. It involves the application of a thin layer of adhesive to the wafer, which holds the wafer in place on the rotating pad during the CMP process. Wafer bonding is performed on a specialized machine, which ensures that the adhesive is applied evenly and consistently to the wafer.

In conclusion, the CMP process is a critical step in the fabrication of semiconductors, providing a fast and efficient method for producing a uniform surface on a wafer. Wafer bonding is an essential component of the CMP process, providing the necessary stability to the wafer during the removal of material. The combination of these two technologies provides a powerful solution for the production of high-quality semiconductors.