Semiconductor CMP Mounting Solution | Calendered Vinyl (PVC) Films Manufacturer | Celadon Tech

Semiconductor process double coated tape | Celadon Technologies: Pioneering the Future of Adhesive Composite Film Materials

Semiconductor CMP Mounting Solution

Semiconductor process double coated tape
Semiconductor process double coated tape

Semiconductors are an essential component in modern electronics and play a crucial role in the functioning of a wide range of devices, from smartphones and computers to automobiles and medical equipment. The fabrication of semiconductors involves a series of complex processes, including the chemical mechanical planarization (CMP) process.

CMP is a process used in semiconductor manufacturing to produce a flat, uniform surface on a wafer. The process involves the use of a rotating pad and a slurry, which is a mixture of chemicals and abrasive particles. The wafer is placed on the pad and then subjected to pressure and movement, which removes material and produces a smooth, uniform surface.

One of the main advantages of the CMP process is its ability to produce a highly uniform surface, which is essential for the functioning of many semiconductor devices. The process is also highly efficient, allowing for the production of large numbers of wafers in a short amount of time.

Wafer bonding is an essential step in the CMP process. It involves the application of a thin layer of adhesive to the wafer, which holds the wafer in place on the rotating pad during the CMP process. Wafer bonding is performed on a specialized machine, which ensures that the adhesive is applied evenly and consistently to the wafer.

In conclusion, the CMP process is a critical step in the fabrication of semiconductors, providing a fast and efficient method for producing a uniform surface on a wafer. Wafer bonding is an essential component of the CMP process, providing the necessary stability to the wafer during the removal of material. The combination of these two technologies provides a powerful solution for the production of high-quality semiconductors.

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Semiconductor CMP Mounting Solution | Semiconductor process double coated tape | Calendered Vinyl (PVC) Films Manufacturer | Celadon Tech

Located in Taiwan since 2007, Celadon Technology Company Ltd. has been a film coating ( PVC, PET, paper, textile) manufacturer. Their main PVC products, include Color Vinyl, Laminate Film, Double Coated Tape, Industry Tape, CAD/CAM Film, Car Wrapping Vinyl, Glitter Paper, Adhesive Transfer Tape and Sandblast Resistant Tape, which are 100% looks like marble, easy maintenance and up to 300% cost saving.

ISO 9001, 14001 and OHSAS18001 certified film supplies with thick coating technology that could coat up to 0.17mm and still maintain its stable, reliable quality. Partial Control Technology has allowed us to deliver coating solutions to RFID, solar panel, marine and car wrap sectors. As well as vinyl and decorative films for semiconductor industry's CMP pad, heavy duty and extreme condition outdoor sport adhesions.

Celadon Tech has been providing Vinyl (PVC) films and tapes to clients, both with advanced technology and 12 years of experience, Celadon Tech ensures each customer's demands are met.

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